Originally Posted by sin0822
that is P1T1's picture right?
Correct, its referenced as such in the article, and used with permission.
Originally Posted by K404
Until someone does a With & without IHS comparison on temperatures and MHz, this is FUD and this story is popping up all over the internet. It's just a theory....
Agree its a theory, one that is tangible which I think makes it interesting considering the other possible explanations. FUD, I don't think so - the heat issue is there in most tests it seems, this is just one way to explain it that no one had been so much as even looking at previously, let alone mentioning. I would hope the article shouldn't inspire FUD - the facts are the facts on the temps - this is just another potential explanation for what we are seeing in the communities.
FWIW, at stock TDP W/mm^2 is .439 for SB, .481 for IB - power density isn't that different. There are tests showing some OC'd/loaded wattage for SB/IB in some reviews, but I don't want to talk about that as those numbers may not be very accurate in how they were obtained (if they are accurate, the power density comes out roughly the same anyways).
There will be problems actually testing the theory. First, can't test the soldered indium IHS on IB, because Intel doesn't appear to be making them that way as far as anyone has found so far. Second, if you remove the IHS, you may need to account for clearance with the clamp/socket as the die sits lower than the IHS. Third, if you remove the IHS, you may need to do custom mounting retention to ensure the pressure is the same/similar - very hard to do accurately. Fourth, in order for the test to be good it depends on the cooler - older coolers used to be designed to cool dies directly, current ones are designed to cool IHS and not for direct die cooling (especially waterblocks, compare storm versus modern block). Fifth, these numbers are getting high and I'm having trouble counting... There are many issues with someone actually doing good/quality tests on this. Some may try, but a test is only as good as the methodology and control.
That said, I would expect a slight improvement by cooling the die directly even with a cooler not designed for cooling the die directly. I think if Intel would be using solder under the IHS, that could be more ideal in light of currently available cooling solutions. Solder IHS was good for E6XXX when TIM paste sucked for E4XXX; solder IHS was good for SB and maybe TIM paste sucks for IB.
Just ideas, and I thought the topic was interesting. Certainly got people talking. I have some other ideas now about why Intel did it, but none as nefarious as some other people are thinking... I think its silly to think they did it to cripple anything.