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Ivy Bridge Temperatures – It’s Gettin’ Hot in Here

Interesting editorial by I.M.O.G. ... worth a read!

Why is Ivy Bridge so hot? Ask that question in any forum currently, and you are likely to receive one of two different popular (but not entirely correct) answers that everyone has been parroting:

  • "Power density is greater on Ivy Bridge than Sandy Bridge"
  • "Intel has problems with tri-gate/22nm"

The first answer is correct, but wrong at the same time – power density is greater, but it isn’t what is causing temperatures to be as much as 20 °C higher on Ivy Bridge compared to Sandy Bridge when overclocked. The second answer is jumping to conclusions without sufficient evidence. If you aren’t in the loop, there’s evidence of a considerable temperature difference nearly everywhere you look – we confirmed it by mirroring settings in our Ivy Bridge review, and we have read similar reports in solid testing at Anandtech as well as from other sites.

So why is Ivy Bridge hot?

Intel is using TIM paste between the Integrated Heat Spreader (IHS) and the CPU die on Ivy Bridge chips, instead of fluxless solder.

...


Apr 26, 2012 - article - overclockers.com
  #21  
Unread 04-28-2012, 18:56
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Originally Posted by K404 View Post
I personally wouldn't because of the channels in-between the heatpipes. Depending on the number of pipes the cooler has, you either have two of them in partial contact with the die, with a gap in the middle OR.... just one pipe along the length of the die. (or should the heatpipes meet the die at right angles??... in that case, 3 might make contact, with gaps in between) I've always been of the opinion that direct contact heatpipes NEED an IHS in order to work well

BUT

if i'm wrong on that, please link me to a comparison that shows it
actually that makes sense, I didn't think of it that way, and thinking of it more... you're right... that was a dumb post. my bad.

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  #22  
Unread 04-28-2012, 19:13
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Quote:
Originally Posted by K404 View Post
http://www.overclock.net/t/1249419/p...ed-without-ihs

Well, that doesn't tell us much. Bad mount?
Looks like that is a real possibility on the bad mount:


I would hope to see a different TIM pattern on the CPU/cooler base, preferably not one in which there is a thicker/thin patch in corresponding areas of CPU/cooler. Looks like the cooler base may not be so flat perhaps, not sure how you end up with a pattern like that.
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Unread 04-29-2012, 01:41
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what is wrong with the pattern? Maybe there just is too much TIM. Either way the guy can just test with another cooler. I don't think the difference will be that much. I personally think perhaps he was scared to crack it so he tried very hard to have even pressure, IMO she should have put some pads on the edges of the CPU to help even the wieght load of the cooler. IMo we need more targeted cooling, I am glad though that your article brought to light doubts about Intel's IHS cooling methods.



IMO so where is the best place to put the temp sensor during LN2 with no lid? Right next to the cores, but how about when you still have the IHS on there?
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Unread 04-29-2012, 12:16
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Originally Posted by I.M.O.G. View Post
I would hope to see a different TIM pattern on the CPU/cooler base, preferably not one in which there is a thicker/thin patch in corresponding areas of CPU/cooler. Looks like the cooler base may not be so flat perhaps, not sure how you end up with a pattern like that.
Seriously, stop being so defensive about your teori and start accepting it failed. Nearly all evidence from people who actually did some testing says replacing thermal interface is not solving any heat-related issues.
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Unread 04-29-2012, 12:36
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Nearly all evidence from people who actually did some testing says replacing thermal interface is not solving any heat-related issues.
Please can you post links? I'm interested in the numbers (i'm sure plenty of other folk are too!)
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Unread 04-29-2012, 12:58
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seriously, Stop Being So Defensive About Your Teori And Start Accepting It Failed. Nearly All Evidence From People Who Actually Did Some Testing Says Replacing Thermal Interface Is Not Solving Any Heat-related Issues.

he's sticking with his TIM theory lol
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Unread 04-29-2012, 23:08
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teori lol its theory.
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Unread 04-29-2012, 23:59
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Not in Swedish it isn't
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Unread 04-30-2012, 14:55
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oh i wasn't aware we were speaking Swedish
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Unread 04-30-2012, 15:20
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Quote:
Originally Posted by ME4ME View Post
Seriously, stop being so defensive about your teori and start accepting it failed. Nearly all evidence from people who actually did some testing says replacing thermal interface is not solving any heat-related issues.
Breath in-breath out home slice. At no point have I felt defensive, perhaps you are interpreting my comments incorrectly?

I would be interested in seeing a test performed with good methodology. A lot of people have contacted me with their results, and I've been sharing feedback on what I would do differently.

Keep in mind as well, no where did my article recommend people to go out and test this themselves. Personally, I think Ivy Bride temperatures would be better if it had a soldered IHS like Sandy Bridge did. Secondly, I think temperatures would probably be a little better if the current IHS was removed, but probably not anything groundbreaking... I probably won't remove mine, as I haven't seen anyone test and show that it improves LN2 cooling.

@sin0822: I would like to see an even distribution in paste. If you can see a definite difference in paste thickness by the naked eye, that implies 2 important things. First, the bond line thickness varies A LOT across the die (it is always going to vary, but ideally it would vary by some measurable amount less than can be seen by the naked eye). Second, the mounting pressure or surface finish may not have been very good to leave a pattern like that.
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Last edited by I.M.O.G.; 04-30-2012 at 15:28.
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