[Ivy-Bridge] IHS removal extreme Test

[Splave]

[riska]

Here is my chip..

It dropped 10c in idle from 39 to 29c at 4.2ghz havent tested it further..

[der8auer]

Here we go

Nice work guys!

riska it will be interesting how liquid metal performs sub zero.

[ME4ME]

Liquid metal is no-go for subzero, when directly in contact with the die. Between metalls, down to -100 it is superior, but then stiffens up en give terrible results.

[der8auer]

I also thought that. So GELID Extreme should be good enough.

[hokiealumnus]

In the interest of saving an order for TIM, does anyone know how Arctic MX-2 would behave cold? It spreads great into a very thin layer.

The only other TIM I have on-hand (and use for sub-zero) is Ceramique 2. Something tells me that would be about as good as the stock Intel TIM between the die & IHS.

[der8auer]

I think every TIM is better than the intel stock one. The quality is so bad it's already completely dry now after few months Ivy is out.

If you can choose between MX2 and Ceramique 2 - pick the first one.

[hokiealumnus]

Yep, I've got both on-hand. I might just try to delid after I finish a couple reviews. Wouldn't want to kill the chip in the mean time.

[McZonk]

Originally Posted by ME4ME

Liquid metal is no-go for subzero, when directly in contact with the die. Between metalls, down to -100 it is superior, but then stiffens up en give terrible results.

Originally Posted by der8auer

I also thought that. So GELID Extreme should be good enough.

You should have quite different thermal expansion coefficients on the liquid metal paste and the silicon. Dropping temperatures stiffens the LM-TIM and the different thermal expansion does the rest and leads to failure in the connection (mikro delamination) - On the other hand it is the best way for the 24/7-overclocker to engage better temps, sure... So for Sub0 the long-established GELID should also do a good job on both sides of the IHS.

[riska]

This chip is only for watercooling it is no good for Ln2 to weak mhz on it